Hong Kong sets June 30 deadline for talent movement in Hetao hub
Hong Kong sets a June 30 deadline for cross-border talent movement in the Hetao innovation hub, alongside plans for an early data flow pilot scheme.
Innovation, Technology and Industry Secretary Sun Dong has set June 30 next year as the latest start date for cross-boundary talent movement within the Hetao innovation hub, giving the scheme its first stated deadline.
Speaking on a radio programme on Sunday, Sun said the movement of people must begin “by June 30 next year at the latest”.
The timeline follows a pledge by the city leader to enable the free movement of data by the end of this year.
Data pilot sought “as soon as possible”
Sun also said Hong Kong hoped to launch a pilot scheme for data flows “as soon as possible”.
“We hope to launch a pilot scheme for data flows as soon as possible. The flow of people must begin by June 30 next year at the latest,” Sun said.
The planned people and data flows are tied to the Hetao innovation hub, where cross-boundary talent movement is expected to be launched by June next year at the latest.
Semiconductor work linked to Greater Bay Area production
Sun said semiconductor production due to begin at the Hong Kong Microelectronics Research and Development Institute this year could materialise scientific results.
He also said the work could pave the way for mass production in the Greater Bay Area.
Source: South China Morning Post
Frequently asked questions
What is the deadline set for cross-boundary talent movement in the Hetao innovation hub?
Innovation, Technology and Industry Secretary Sun Dong stated that the movement of people must begin by June 30 next year at the latest.
When does Hong Kong hope to launch a pilot scheme for data flows?
Hong Kong hopes to launch a pilot scheme for data flows as soon as possible, following a pledge by the city leader to enable the free movement of data by the end of the year.
Where is semiconductor production due to begin this year?
Semiconductor production is due to begin at the Hong Kong Microelectronics Research and Development Institute.
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